© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1020-4 • 6/22/2010

11

11

Surface Mount Multilayer Ceramic Chip Capacitors –KPS Series – Commercial Grade (X7R Dielectric)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

Table 7 - Punched (Paper) Carrier Tape Dimensions

(Metric will govern)

1. The cavity defined by A

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 5).

Constant Dimensions — Millimeters (Inches)

Tape Size

D

0

E

1

P

0

P

2

T

G Min

R Ref.

Note 2

8mm

1.5 +0.10-0.0

(0.059 +0.004, -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.10

(.004) Max.

0.75

(.030)

25

(.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

Pitch

E2 Min

F

P

1

T Max

W Max

A

8mm

Half (2mm)

6.25

(0.246)

3.5 ± 0.05

(0.138 ± 0.002)

2.0 ± 0.05

(0.079 ± 0.002)

1.1

(0.098)

8.3

(0.327)

Note 5

8mm

Single (4mm)

4.0 ± 0.10

(0.157 ± 0.004)

8.3

(0.327)

User Direction of Unreeling

Top Cover Tape

T

Center Lines of Cavity

ØDo

Po

F

W

G

Cavity Size,

See

Note 1, Table 7

Bottom Cover Tape

Bottom Cover Tape

[10 pitches cumulative

tolerance on tape ±0.2 mm]