PCF8564ACX9-1 datasheet(2/45 Pages) NXP

Part #	PCF8564ACX9-1

Description	Real time clock and calendar

Download	45 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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PCF8564A

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 02 — 30 September 2010

2 of 45

NXP Semiconductors

PCF8564A

Real time clock and calendar

4.

Ordering information

5.

Marking

Table 1.

Ordering information

Type number

Package

Name

Description

Delivery form

Version

PCF8564AU/5BB/1

PCF8564AU

wire bond die; 9 bonding pads

unsawn wafer

PCF8564AU

PCF8564AU/5GB/1

PCF8564AU

wire bond die; 9 bonding pads

unsawn wafer

PCF8564AU

PCF8564AU/5GC/1

PCF8564AU

wire bond die; 9 bonding pads

unsawn wafer

PCF8564AU

PCF8564AU/10AB/1

PCF8564AU

wire bond die; 9 bonding pads

wafer sawn on FFC

PCF8564AU

PCF8564ACX9/1

PCF8564ACX9

wafer level chip-size package;

9 bumps; 1.27

× 1.9 × 0.29 mm

wafer sawn on FFC;

die with solder bumps

PCF8564ACX9

PCF8564ACX9/B/1

PCF8564ACX9

wafer level chip-size package;

9 bumps; 1.27

× 1.9 × 0.29 mm

tape and reel;

die with solder bumps

PCF8564ACX9

Table 2.

Marking codes

Type number

Marking code

PCF8564AU/5BB/1

PC8564A-1

PCF8564AU/5GB/1

PC8564A-1

PCF8564AU/5GC/1

PC8564A-1

PCF8564AU/10AB/1

PC8564A-1

PCF8564ACX9/1

PC8564A-1

PCF8564ACX9/B/1

PC8564A-1

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Manufacturer	Part #	Datasheet	Description
NXP Semiconductors	PCF8564ACX9/1	924Kb / 44P	Real time clock and calendar Rev. 1-8 October 2009
NXP Semiconductors	PCF8564ACX9/B/1	924Kb / 44P	Real time clock and calendar Rev. 1-8 October 2009

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PCF8564ACX9-1 Datasheet(PDF) 2 Page - NXP Semiconductors

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