TPS54320

SLVS982A – AUGUST 2010 – REVISED SEPTEMBER 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

–40°C to 150°C

14 Pin QFN

TPS54320RHL

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

The RHL package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54320RHLR). See applications section

of data sheet for layout information.

ABSOLUTE MAXIMUM RATINGS

(1)

over operating temperature range (unless otherwise noted)

VALUE

UNIT

VIN

–0.3 to 20

V

PVIN

–0.3 to 20

V

EN

–0.3 to 6

V

BOOT

–0.3 to 27

V

Input Voltage

VSENSE

–0.3 to 3

V

COMP

–0.3 to 3

V

PWRGD

–0.3 to 6

V

SS/TR

–0.3 to 3

V

RT/CLK

–0.3 to 6

V

BOOT-PH

0 to 7

V

Output Voltage

PH

–1 to 20

V

PH 10ns Transient

–3 to 20

V

Vdiff

GND to exposed thermal pad

–0.2 to 0.2

V

RT/CLK

±100

mA

Source Current

PH

Current Limit

A

PH

Current Limit

A

PVIN

Current Limit

A

Sink Current

COMP

±200

mA

PWRGD

–0.1 to 5

mA

Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A)

2

kV

Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01)

500

V

Operating Junction Temperature

–40 to 150

°C

Storage Temperature

–65 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2

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