Document Number: 28164

www.vishay.com

Revision: 27-May-11

291

MKP 1848 DC-Link

Metallized Polypropylene Film Capacitors

DC Capacitor MKP Type

Vishay Roederstein

This document is subject to change without notice.

HEAT CONDUCTIVITY

Power Dissipation and Maximum Component Temperature Rise

The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of

the free air ambient temperature.

The component temperature rise (

T) can be measured or calculated by T = P/G:

T = T

 P = I

RMS

 G = heat conductivity of the component (mW/°C)

50

60

70

80

90

100

110

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

Maximum ambient temperature (°C)

DIMENSIONS (mm)

HEAT CONDUCTIVITY (mW/°C)

w

hl

9.0

19.0

32.0

24

11.0

21.0

32.0

28

13.0

23.0

32.0

32

15.0

25.0

32.0

36

18.0

28.0

32.0

44

21.0

31.0

32.0

51

21.0

35.0

32.0

56

18.5

35.5

43.0

54

21.5

38.5

43.0

61

24.0

44.0

42.0

70

30.0

45.0

42.0

81

25.0

45.0

57.5

77

30.0

45.0

57.5

85

35.0

50.0

57.5

100

45.0

45.0

57.5

94

70.0

65.0

57.5

152

130.0

65.0

57.5

243