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HMC976LP3E Datasheet(PDF) 10 Page - Hittite Microwave Corporation |
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HMC976LP3E Datasheet(HTML) 10 Page - Hittite Microwave Corporation |
10 / 12 page 9 9 - 10 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com Application Support: apps@hittite.com HMC976LP3E 400mA LOW NOISE, HIGH PSRR LINEAR VOLTAGE REGULATOR v01.0711 Thermal dissipation should be taken into account at all times especially with large VDD-VR values i.e. if 1.8V is required from 5.5V VIN then the output current must be restricted to <210mA , or VDD restricted to <3.75V for a 400mA load. The following plots show the board ground copper area influence, on junction temperature for ambient temperatures of 25°C, 50°C, 85°C vs. Total power dissipated in the device. The conditions for the plots are : 1. 100mm2 Copper Area 2. 1000mm2 Copper Area 3. 2580mm2 Copper Area HMC976LP3E Evaluation PCB No Heat Sink 4. 2580mm2 Copper Area HMC976LP3E Evaluation PCB with Heat Sink 5. JEDEC Board as per JESD51-3 HMC976LP3E JUNCTION TEMPERATURE °C vs. TOTAL POWER DISSIPATION 25°C AMBIENT 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 POWER DISSIPATION (W) Tjmax 1000mm 2 no HS 2580mm 2 no HS 2580mm 2 with HS 100 mm 2 no HS JEDEC no HS 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 POWER DISSIPATION (W) Tjmax JEDEC no HS 2580mm 2 with HS 2580mm 2 no HS 1000mm 2 no HS 100mm 2 no HS 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 POWER DISSIPATION (W) 100mm 2 no HS 2580mm 2 with HS 2580mm 2 no HS 1000mm 2 no HS Tjmax JEDEC no HS HMC976LP3E JUNCTION TEMPERATURE °C vs. TOTAL POWER DISSIPATION 50°C AMBIENT HMC976LP3E JUNCTION TEMPERATURE °C vs. TOTAL POWER DISSIPATION 85°C AMBIENT |
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