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Document Number: 89338

4

Revision: 04-May-11

This document is subject to change without notice.

AU3PD, AU3PG, AU3PJ

Vishay General Semiconductor

New Product

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Conform to JEDEC TO-277A

TO-277A (SMPC)

0.016 (0.40)

0.006 (0.15)

0.047 (1.20)

0.039 (1.00)

0.146 (3.70)

0.134 (3.40)

0.087 (2.20)

0.075 (1.90)

0.189 (4.80)

0.173 (4.40)

0.049 (1.24)

0.037 (0.94)

0.053 (1.35)

0.041 (1.05)

0.030 (0.75) NOM.

0.084 (2.13) NOM.

0.155 (3.94)

NOM.

Mounting Pad Layout

0.268

(6.80)

0.186 (4.72)

MIN.

0.050 (1.27)

MIN.

0.041

(1.04)

0.055 (1.40)

MIN.

0.189 (4.80)

MIN.

0.187 (4.75)

0.175 (4.45)

0.262 (6.65)

0.250 (6.35)

0.242 (6.15)

0.238 (6.05)

0.171 (4.35)

0.167 (4.25)

K

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