150 CRZ

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Vishay BCcomponents

Revision: 17-Jun-11

5

Document Number: 28395

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

STANDARD SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Notes

•

Temperature measuring point on top of the case and on terminals.

•

Max. 2 runs with pause of min. 30 min in between.

REFLOW SOLDERING CONDITIONS for MAL215097xxxE3

PROFILE FEATURES

CASE CODE

0810 TO 1014

CASE CODE

1213 TO 1216

240 s

200 s

Min. ramp-up rate to 150 °C

3 K/s

3 K/s

150 s

120 s

0.5 K/s to 3 K/s

0.5 K/s to 3 K/s

60 s

60 s

90 s

60 s

40 s

30 s

250 °C

240 °C

5 s

10 s

3 K/s to 6 K/s

3 K/s to 6 K/s

t

1

200

150

217

230

T

Peak

time (s)

T (°C)

t

2

t

3

t

4