9

FN6588.1

January 21, 2008

ISL23511

Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)

6

B

E

A

D

0.10 C

2X

2

0.10 M C A B

0.05 M C

(ND-1) X e

C

0.05 C

A

0.10 C

A1

SEATING PLANE

e

INDEX AREA

PIN #1 ID

3

5

(DATUM A)

(DATUM B)

N-1

1

N

NX L

NX b

2

1

N

TOP VIEW

BOTTOM VIEW

SIDE VIEW

NX (b)

SECTION "C-C"

FOR ODD TERMINAL/SIDE

e

CC

5

C

L

TERMINAL TIP

(A1)

L

DETAIL “A” PIN 1 ID

L

0.05 MIN

0.10 MIN

0.10 C

2X

4xk

b

L10.2.1x1.6A

10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC

PACKAGE

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

5

D

2.05

2.10

2.15

-

E

1.55

1.60

1.65

-

e

0.50 BSC

-

k0.20

--

-

L

0.35

0.40

0.45

-

N10

2

Nd

4

3

Ne

1

3

θ

0-

12

4

Rev. 3 6/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on D and E side,

respectively.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Maximum package warpage is 0.05mm.

8. Maximum allowable burrs is 0.076mm in all directions.

9. Same as JEDEC MO-255UABD except:

No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm

"L" MAX dimension = 0.45 not 0.42mm.

10. For additional information, to assist with the PCB Land Pattern

Design effort, see Intersil Technical Brief TB389.

2.00

0.80

1.75

0.25

0.50

0.275

2.50

LAND PATTERN 10