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250S130-RA Datasheet(PDF) 3 Page - Littelfuse |
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250S130-RA Datasheet(HTML) 3 Page - Littelfuse |
3 / 5 page 59 ©2009 Littelfuse, Inc. Revised: November 30, 2009 POLYFUSE® Resettable PTCs Surface Mount > 250S Series 250S Series Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/250S.html for current information. Soldering Parameters Profile Feature Pb-Free Assembly Average Ramp-Up Rate (T S(max) to TP) 3°C/second max Pre Heat: Temperature Min (T s(min)) 150°C Temperature Max (T s(max)) 200°C Time (Min to Max) (t s) 60 – 180 secs Time Maintained Above: Temperature (T L) 217°C Temperature (t L) 60 – 150 seconds Peak / Classification Temperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (T P) 8 minutes Max. -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N 2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices Environmental Specifications Operating/Storage Temperature -40°C to +85°C Maximum Device Surface Temperature in Tripped State 125°C -/+10ºC Passive Aging +85°C, 1000 hours Humidity Aging +85°C, 85%,R.H.,1000 hours Thermal Shock MIL–STD–202F, Method 107G +125°C to -55°C 10 times Solvent Resistance MIL–STD–202, Method 215F Moisture Sensitivity Level Level 1, J–STD–020C Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin(Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/ J-STD-002 Category 3. |
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