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©2009 Littelfuse, Inc.

Revised: November 30, 2009

Surface Mount > 250S Series

250S Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/250S.html for current information.

Soldering Parameters

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (T

3°C/second max

Pre Heat:

Temperature Min (T

150°C

Temperature Max (T

200°C

Time (Min to Max) (t

60 – 180 secs

Time Maintained

Above:

Temperature (T

217°C

Temperature (t

60 – 150 seconds

Peak / Classification Temperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

-- If reflow temperature exceeds the recommended profile, devices may not meet the

performance requirements

-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N

for lead

-- Recommended maximum paste thickness is 0.25mm (0.010inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices

Environmental Specifications

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped State

125°C -/+10ºC

Passive Aging

+85°C, 1000 hours

Humidity Aging

+85°C, 85%,R.H.,1000 hours

Thermal Shock

MIL–STD–202F, Method 107G

+125°C to -55°C 10 times

Solvent Resistance

MIL–STD–202, Method 215F

Moisture Sensitivity Level

Level 1, J–STD–020C

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material:

Matte Tin(Sn))

Lead Solderability

Meets EIA Specification RS186-9E, ANSI/

J-STD-002 Category 3.