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BD6586MUV Datasheet(PDF) 9 Page - Rohm |
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BD6586MUV Datasheet(HTML) 9 Page - Rohm |
9 / 20 page Technical Note 9/19 www.rohm.com 2011.6 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6586MUV SW SW SW TEST0 TEST N.C. ISET EN2 LE D6 LE D5 LED 4 LED 3 LE D2 VBAT EN1 GND PWM CVBAT to GND to Anode of each LED BD6586MUV to Power Supply COUT CIN SBD L RISET 1 2 3 4 5 6 7 8 9 10 11 12 18 17 16 15 14 13 24 23 22 21 20 19 PWM (100Hz~1000Hz) to Anode of LED to Power Supply Thermal Via Thermal Via ● PCB Layout In order to make the most of the performance of this IC, its layout pattern is very important. Characteristics such as efficiency and ripple and the likes change greatly with layout patterns, which please note carefully. Fig.9 PCB Layout Connect the input bypath capacitor CIN nearest to coil L and PGND, as shown in the upper diagram. Ripple of a power supply is smoothed by CIN and connect stable voltage to VBAT terminal by the low resistance. Thereby, the input voltage ripple of the IC can be reduced. Connect CVBAT nearest to between the VBAT terminal and GND (4 pin) as shown in the upper diagram when you can't be wired by the low resistance from CIN to VBAT pin Connect schottky barrier diode SBD of the regulator nearest to between coil L and SW terminal. And connect output capacitor COUT nearest to between CIN and GND pin. Thereby, the output voltage ripple of the IC can be reduced. GND terminal (4,7,10 pin) is connected inside the IC, and it is GND of the block except switching and a transistor. A current drive performance may be restricted by influence of a noise, if PGND which is not smooth connected to GND. A GND terminal is connected to the stable GND plane. And connect it to a GND plane after smoothing PGND by CIN and COUT. GND and PGND are separated inside IC. And connect it to a GND plane after smoothing PGND by CIN and COUT. Connect the heat sink of IC to a GND plane through Thermal Via. And Connect with the largest possible pattern. It is satisfactory even if it connects with the GND terminal of IC. Connect LED current setting resistor RISET nearest to ISET pin. There is possibility to oscillate when capacity is added to ISET terminal, so pay attention that capacity isn't added. And, RISET of GND side must be wired directly to GND(7pin) pin. When those pins are not connected directly near the chip, influence is given to the performance of BD6586MUV, and may limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce electric power consumption and increase the entire efficiency. A layout pattern in consideration of these is shown in p.12. |
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