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BD8961NV Datasheet(PDF) 11 Page - Rohm |
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BD8961NV Datasheet(HTML) 11 Page - Rohm |
11 / 14 page Technical Note BD8961NV 11/13 www.rohm.com 2010.04 - Rev.B © 2010 ROHM Co., Ltd. All rights reserved. ● BD8961NV Cautions on PC Board layout Fig.32 Layout diagram ① For the sections drawn with heavy line, use thick conductor pattern as short as possible. ② Lay out the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to the pin PGND. ③ Lay out CITH and RITH between the pins ITH and GND as near as possible with least necessary wiring. ※ SON008V5060 (BD8961NV) has thermal FIN on the reverse of the package. The package thermal performance may be enhanced by bonding the FIN to GND plane which take a large area of PCB. ● Recommended components Lists on above application Symbol Part Value Manufacturer Series L Coil 2.2uH TDK LTF5022-2R2N3R2 CIN Ceramic capacitor 22uF Kyocera CM32X5R226M10A CO Ceramic capacitor 22uF Kyocera CM316B226M06A CITH Ceramic capacitor 680pF murata GRM18 Serise RITH Resistance 12kΩ Rohm MCR03Serise *The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these margins. When switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier diode established between the SW and PGND pins. ● I/O equivalence circuit Fig.33 I/O equivalence circuit VOUT VCC ITH GND EN PVCC SW PGND VCC RITH GND Co CIN VOUT EN L CITH ③ ① ② 1 2 3 4 8 7 6 5 EN ・ EN pin ・ SW pin PVCC SW PVCC PVCC ITH ・ ITH pin VCC VCC VOUT 10kΩ ・ VOUT pin |
Similar Part No. - BD8961NV_10 |
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Similar Description - BD8961NV_10 |
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