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2011.02 - Rev.A

© 2011 ROHM Co., Ltd. All rights reserved.

System Lens Drivers for Digital Cameras/SLRs (Single-lens Reflex)

1-2ch Lens Drivers for SLRs

(Single-lens Reflex)

BD65491FV,BD65492MUV

●

Description

The BD65491FV motor driver provides 1 Full-ON Drive H-bridge channel, while BD65492MUV provides 2 Full-ON Drive

H-bridge channels. These lens driver series feature wide range operating from 1.8V and low power consumption by high

switching speed in a compact surface mount package.

●

Features

1) Low ON-Resistance Power DMOS output:

Full-ON Drive block with 0.35Ω Typ. (BD65491FV)

Full-ON Drive block with0.9Ω Typ. (BD65492MUV)

2) Range of motor power supply voltage: 1.8V to 16.0V

3) Charge pump-less type with p-channel DMOS for the upper side transistor

4) The highest performance in regard to switching speed, and 4-values selection

Turn On Time: 150ns (BD65491FV), 200ns (BD65492MUV)

Turn Off Time: 50ns(BD65491FV),

80ns(BD65492MUV)

5) Drive mode switch function

6) Maximum output current for H-bridge:

DC maximum 1.2A (BD65491FV), 1.0A (BD65492MUV)

Peak maximum 4.0A (BD65491FV)

7) Control input pins corresponding to the signal of 1.8V system

8) Built-in UVLO (Under Voltage Lockout Protection) function and TSD (Thermal Shut Down) circuit

9) Standby current: 0μA Typ.

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Absolute Maximum Ratings

Parameter

Symbol

Ratings

Unit

BD65491FV

BD65492MUV

Power supply voltage

VCC

-0.5～+7.0

-0.5～+7.0

V

Motor power supply voltage

VM

-0.5～+20.0

-0.5～+20.0

V

Control input voltage

VIN

-0.5～VCC+0.5

-0.5～VCC+0.5

V

Power dissipation

Pd

870

*1

700

*2

mW

2200

*3

mW

3560

*4

mW

Junction temperature

Tjmax

+150

+150

℃

Storage temperature range

Tstg

-55～+150

-55～+150

℃

H-bridge output current (DC)

Iout

-1200～+1200

*5

-1000～+1000

*5

mA/ch

H-bridge output current (Peak

-3200～+3200

*6

mA/ch

H-bridge output current (Peak

-4000～+4000

*7

mA/ch

*1 Reduced by 6.96mW/℃ over 25℃, when mounted on a glass epoxy board (70mm

 70mm  1.6mm)

*2 Reduced by 5.6mW/℃ over 25℃, when mounted on a glass epoxy 1-layer board (74.2mm

 74.2mm  1.6mm).

In surface layer copper foil area: 10.29mm

2.

*3 Reduced by 17.6mW/℃ over 25℃, when mounted on a glass epoxy 4-layers board (74.2mm

 74.2mm  1.6mm).

In surface & the back layers copper foil area: 10.29mm2, in 2&3-layers copper foil area: 5505mm

*4 Reduced by 28.4mW/℃ over 25℃, when mounted on a glass epoxy 4-layers board (74.2mm

 74.2mm  1.6mm).

In all 4-layers copper foil area: 5505mm

*5 Must not exceed Pd, ASO, or Tjmax of 150℃.

*6 Peak=100msec (Duty≦20%)

*7 Peak=10msec (Duty≦5%)

No.11014EAT05