BH□□RB1WGUT series

Technical Note

5/8

www.rohm.com

2011.01 - Rev.C

© 2011 ROHM Co., Ltd. All rights reserved.

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Block Diagram, Recommended Circuit Diagram, and Pin Assignment Diagram

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Power Dissipation (Pd)

1.

Power dissipation (Pd)

Power dissipation calculations include output power dissipation characteristics and internal IC power consumption. In

the event that the IC is used in an environment where this power dissipation is exceeded, the attendant rise in the

junction temperature will trigger the thermal shutdown circuit, reducing the current capacity and otherwise degrading the

IC's design performance. Allow for sufficient margins so that this power dissipation is not exceeded during IC operation.

2.

Power dissipation/power dissipation reduction (Pd)

VCSP60N1

*Circuit design should allow a sufficient margin for the temperature range for PMAX < Pd.

Fig. 25 VCSP60N1 Power Dissipation/Power Dissipation Reduction (Example)

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Input Output Capacitors

It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as

possible. These capacitors are used when the power supply impedance increases or when long wiring paths are used, so

they should be checked once the IC has been mounted. Ceramic capacitors generally have temperature and DC bias

characteristics. Use X5R or X7R ceramic capacitors, which offer good temperature and DC bias characteristics as well as

stable high voltages.

Typical ceramic capacitor characteristics

Pin No.

Symbol

Function

B2

Power supply input

B1

Voltage output

A1

GND

Ground

A2

STBY

Output voltage on/off control

(High: ON, Low: OFF)

0

20

40

60

80

100

120

01

2

34

DC bias Vdc (V)

70

75

80

85

90

95

100

01

2

34

DC bias Vdc (V)

50 V

torelance

16 V torelance

10 V torelance

50 V torelance

16 V torelance

10 V torelance

Fig. 26 Capacitance vs Bias (Y5V)

Fig.27 Capacitance vs Bias

(X5R, X7R)

Fig. 28 Capacitance vs Temperature

(X5R, X7R, Y5V)

Fig. 24

Board: 7 mm

 7 mm  0.8 mm

Material: Glass epoxy PCB

0

0.2

0.4

0.6

0

25

50

75

100

125

Ta[℃]

530 mW

Cin: 1.0 µF

Co: 1.0 µF

TH ERMAL

PROTECTION

O VER CU RRENT

PROTECTION

VO LTAGE

R EFERENCE

C ONTROL

BLOCK

B1

A1

B2

A2

Cin

VOUT

Co

VIN

VIN

GND

VSTBY

VOUT

STBY

A

B

2

1

TOP VIEW (Mark side)

1PIN MARK

BH□□RB1WGUT

0

20

40

60

80

100

120

-25

0

25

50

75

Temp[℃]

Y5V

X7R

X5R