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BH33RB1WGUT-E2 Datasheet(PDF) 5 Page - Rohm |
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BH33RB1WGUT-E2 Datasheet(HTML) 5 Page - Rohm |
5 / 9 page BH□□RB1WGUT series Technical Note 5/8 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. ● Block Diagram, Recommended Circuit Diagram, and Pin Assignment Diagram ● Power Dissipation (Pd) 1. Power dissipation (Pd) Power dissipation calculations include output power dissipation characteristics and internal IC power consumption. In the event that the IC is used in an environment where this power dissipation is exceeded, the attendant rise in the junction temperature will trigger the thermal shutdown circuit, reducing the current capacity and otherwise degrading the IC's design performance. Allow for sufficient margins so that this power dissipation is not exceeded during IC operation. Calculating the maximum internal IC power consumption (PMAX) PMAX = (VIN - VOUT) IOUT (MAX.) VIN: Input voltage VOUT: Output voltage IOUT (MAX): Output current 2. Power dissipation/power dissipation reduction (Pd) VCSP60N1 *Circuit design should allow a sufficient margin for the temperature range for PMAX < Pd. Fig. 25 VCSP60N1 Power Dissipation/Power Dissipation Reduction (Example) ● Input Output Capacitors It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as possible. These capacitors are used when the power supply impedance increases or when long wiring paths are used, so they should be checked once the IC has been mounted. Ceramic capacitors generally have temperature and DC bias characteristics. Use X5R or X7R ceramic capacitors, which offer good temperature and DC bias characteristics as well as stable high voltages. Typical ceramic capacitor characteristics Pin No. Symbol Function B2 VIN Power supply input B1 VOUT Voltage output A1 GND Ground A2 STBY Output voltage on/off control (High: ON, Low: OFF) 0 20 40 60 80 100 120 01 2 34 DC bias Vdc (V) 70 75 80 85 90 95 100 01 2 34 DC bias Vdc (V) 50 V torelance 16 V torelance 10 V torelance 50 V torelance 16 V torelance 10 V torelance Fig. 26 Capacitance vs Bias (Y5V) Fig.27 Capacitance vs Bias (X5R, X7R) Fig. 28 Capacitance vs Temperature (X5R, X7R, Y5V) Fig. 24 Board: 7 mm 7 mm 0.8 mm Material: Glass epoxy PCB 0 0.2 0.4 0.6 0 25 50 75 100 125 Ta[℃] 530 mW Cin: 1.0 µF Co: 1.0 µF TH ERMAL PROTECTION O VER CU RRENT PROTECTION VO LTAGE R EFERENCE C ONTROL BLOCK B1 A1 B2 A2 Cin VOUT Co VIN VIN GND VSTBY VOUT STBY A B 2 1 TOP VIEW (Mark side) 1PIN MARK BH□□RB1WGUT 0 20 40 60 80 100 120 -25 0 25 50 75 Temp[℃] Y5V X7R X5R |
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