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GP2W0104YP Datasheet(PDF) 9 Page - Sharp Corporation |
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GP2W0104YP Datasheet(HTML) 9 Page - Sharp Corporation |
9 / 14 page 115 kbps Transceiver GP2W0104YP IrDA Data Sheet 9 PRECAUTIONS FOR SOLDERING Solder Reflow Solder only once at the temperature and the time within the temperature profile as shown in Figure 14. Other Precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Figure 14. Also avoid immersing the resin part in the solder. Even if within the temperature profile shown in Figure 14, there is the possibility that the gold wire in the package may break if the deformation of the PCB affects the lead pins. Use after fully confirming the conditions of actual solder reflow machine. Soldering • Soldering iron shall be less than 25 W, and temper- ature of soldering iron point shall be used at less than 260°C. • Soldering time shall be within 5 seconds. • Soldered product shall treat at normal temperature. • Solder: 6/4 solder or included Ag solder. Figure 14. Temperature Profile 1 - 4 °C/s 200 °C 230 °C MAX. 165 °C MAX. 25 °C 120 s MAX. 90 s MAX. 60 s MAX. 5 s MAX. 1 - 4 °C/s 1 - 4 °C/s GP2W0104YP-14 |
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