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FH39-45S-0.3SHW Datasheet(PDF) 8 Page - Hirose Electric |
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FH39-45S-0.3SHW Datasheet(HTML) 8 Page - Hirose Electric |
8 / 11 page FH39 Seriesq0.3 mm Pitch, 1.2 mm above the board, Top and bottom Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors 8 sTemperature Profile HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-221CM5-32-10.5) Test board :Glass epoxy 25mm∞50mm∞0.8mm thick Land dimensions :0.3mm∞0.5mm, 0.3mm∞0.67mm Metal mask :0.25∞0.42, 0.25∞0.57∞0.1mm thick The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Start (ç) 0 50 100 150 200 250 MAX 250ç Time (Seconds) 25ç (60sec.) (60sec.) 90 sec. to 120 sec. Preheating Soldering 150ç 200ç 230ç The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. |
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