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MBRF2560CT Datasheet(PDF) 1 Page - Taiwan Semiconductor Company, Ltd |
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MBRF2560CT Datasheet(HTML) 1 Page - Taiwan Semiconductor Company, Ltd |
1 / 2 page CREAT BY ART UL Recognized File # E-326243 Low power loss, high efficiency High current capability, low forward voltage drop Guard-ring for overvoltage protection Mechanical Data MBRF25XXCT = Specific Device Code G = Green Compound Y = Year WW = Work Week Maximum Ratings and Electrical Characteristics Rating at 25 ℃ ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol MBRF 2535 CT MBRF 2545 CT MBRF 2550 CT MBRF 2560 CT MBRF 2590 CT MBRF 25100 CT MBRF 25150 CT Unit VRRM 35 45 50 60 90 100 150 V VRMS 24 31 35 42 63 70 105 V VDC 35 45 50 60 90 100 150 V IRRM A 0.95 0.92 1.02 0.98 5 dV/dt V/us Cj pF TJ OC TSTG OC RMS Isolation Voltage (t=1.0 second, R.H.≦30%,TA=25℃) VISO V 3500 (Note 4) 1500 (Note 5) 4500 (Note 3) Typical Thermal Resistance Per Leg RθjA RθjC 8.0 1.0 OC/W Voltage Rate of Change (Rated VR) Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Peak Repetitive Reverse Surge Current (Note 1) Peak Forward Surge Current, 8.3 ms Single Half Sine- wave Superimposed on Rated Load (JEDEC method) Maximum Average Forward Rectified Current at Tc=130℃ Peak Repetitive Forward Current (Rated VR, Square Wave, 20KHz) at Tc=130℃ IR Version:G11 Note 2: Pulse Test : 300uS Pulse Width, 1% Duty Cycle Note 1: 2.0uS Pulse Width, f=1.0KHz Operating Temperature Range Storage Temperature Range - 65 to + 150 - 65 to + 150 Note 3: Clip Mounting (on case), where lead does not overlap heatsink with 0.11" offset Note 4: Clip Mounting (on case), where lead do overlap heatsink. Note 5: Screw mounting with 4-40 screw, where washer diameter is≦4.9mm (0.19") MBRF2535CT - MBRF25150CT Marking Diagram ITO-220AB 25.0 AMPS. Isolated Schottky Barrier Rectifiers Dimensions in inches and (millimeters) Case:ITO-220AB molded plastic body Features High surge capability Metal silicon junction, majority carrier conduction High temperature soldering guaranteed: 260℃/10 seconds, at terminals Terminals: Pure tin plated, lead free, solderable per MIL-STD-750, Method 2026 Maximum Reverse Current @ Rated VR TA=25 ℃ TA=125 ℃ Polarity: As marked Mounting torque: 5 in. - lbs, max Mounting position:Any Plastic material used carriers Underwriters Laboratory Classification 94V-0 Weight: 1.75 grams Typical Junction Capacitance Type Number A Green compound with suffix "G" on packing code & prefix "G" on datecode For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications IF(AV) A IFSM Maximum Instantaneous Forward Voltage (Note 2) IF=12.5A, TA=25℃ IF=12.5A, TA=125℃ IF=25A, TA=25℃ IF=25A, TA=125℃ VF 0.82 IFRM 0.75 0.65 - 0.92 - - 0.85 1 0.5 25 25 200 A V 15 10 2 7.5 0.88 0.73 - 0.1 0.75 580 480 10000 mA Pb RoHS COMPLIANCE RoHS COMPLIANCE |
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