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MSP430F2101IPW Datasheet(PDF) 3 Page - Texas Instruments |
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MSP430F2101IPW Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 60 page  1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 TEST V CC P2.5/CA5 V SS XOUT/P2.7/CA7 XIN/P2.6/CA6 RST/NMI P2.0/ACLK/CA2 P2.1/INCLK/CA3 P2.2/CAOUT/TA0/CA4 P1.7/TA2/TDO/TDI P1.6/TA1/TDI/TCLK P1.5/TA0/TMS P1.4/SMCLK/TCK P1.3/TA2 P1.2/TA1 P1.1/TA0 P1.0/TACLK P2.4/TA2/CA1 P2.3/TA1/CA0 11 10 9 8 7 12 5 RST/NMI 4 XIN/P2.6/CA6 3 XOUT/P2.7/CA7 2 V SS 1 NC 6 P2.0/ACLK/CA2 14 P1.1/TA0 15 P1.2/TA1 16 P1.3/TA2 17 P1.4/SMCLK/TCK 18 P1.5/TA0/TMS 13 P1.0/TACLK 20 21 22 23 24 19 Exposed Thermal Pad MSP430F21x1 www.ti.com SLAS439F – SEPTEMBER 2004 – REVISED AUGUST 2011 Device Pinout DW, PW, or DGV PACKAGE (TOP VIEW) RGE PACKAGE (TOP VIEW) A. NC = Not internally connected B. Exposed thermal pad connection to VSS recommended. Copyright © 2004–2011, Texas Instruments Incorporated 3 |
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