TPS54160-Q1

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SLVS922E

– JULY 2009 – REVISED MARCH 2011

THERMAL INFORMATION

TPS54160-Q1

DGQ

DRC

UNITS

10 PINS

10 PINS

Junction-to-ambient thermal resistance (standard board)

62.5

56.5

57

61.5

Junction-to-case (top) thermal resistance

83

52.1

Junction-to-board thermal resistance

28

20.6

°C/W

Junction-to-top characterization parameter

1.7

0.9

Junction-to-board characterization parameter

20.1

20.8

Junction-to-case (bottom) thermal resistance

21

5.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

distortion starts to substantially increase. See power dissipation estimate in application section of this data sheet for more information.

(3)

Test boards conditions:

(a) 3 inches x 3 inches, 2 layers, thickness: 0.062 inch

(b) 2 oz. copper traces located on the top of the PCB

(c) 2 oz. copper ground plane, bottom layer

(d) 6 thermal vias (13mil) located under the device package

Copyright

© 2009–2011, Texas Instruments Incorporated

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