PSMN7R0-30YLC

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Product data sheet

Rev. 2 — 1 September 2011

11 of 15

NXP Semiconductors

PSMN7R0-30YLC

N-channel 30 V 7.1 m

Ω logic level MOSFET in LFPAK using NextPower technology

7.

Package outline

Fig 19. Package outline SOT669 (LFPAK; Power-SO8)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT669

MO-235

06-03-16

11-03-25

0

2.5

5 mm

scale

e

E1

b

c2

A2

A2

bc

A

e

UNIT

DIMENSIONS (mm are the original dimensions)

mm

1.10

0.95

A3

A1

0.15

0.00

1.20

1.01

0.50

0.35

b2

4.41

3.62

b3

2.2

2.0

b4

0.9

0.7

0.25

0.19

c2

0.30

0.24

4.10

3.80

6.2

5.8

H

1.3

0.8

L2

0.85

0.40

L

1.3

0.8

L1

8

°

0

°

wy

5.0

4.8

3.3

3.1

E1

(1)

D1

(1)

max

0.25

4.20

1.27

0.25

0.1

1

23

4

mounting

base

D1

c

Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads

SOT669

E

b2

b3

b4

H

D

L2

L1

A

A

C

C

X

1/2

e

yC

θ

θ

(A )

3

L

A

A1

detail X

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.