SENSITRON

SEMICONDUCTOR

TECHNICAL DATA

©2010 Sensitron Semiconductor

• 221 West Industry Court • Deer Park, NY 11729-4681

Phone (631) 586 7600 Fax (631) 242 9798

• www.sensitron.com • sales@sensitron.com • Page 10

SPDPXXD28-1 SERIES

MIL-W-5088L has various figures showing derating for harnesses as a function of the number of current carrying

conductors for different altitudes.

MIL-W-5088L only specifies wire for DC or RMS AC conditions, not for

transient or overload conditions. MIL-W-5088L and its amendment should be consulted to determine minimum

wire sizes for other currents and conditions.

For transient or overload conditions, the transient or overload happens so quickly that heat is not transferred

from the wire to the surroundings. The heat caused by the I

rise at a linear rate controlled by the heat capacity of the wire. The equation for this linear rise in temperature,

with respect to time, can be solved as: I

temperature rise allowed and the diameter of the wire. If the I

the I

SPDP25D28-1 is 7.45 x 10

exceeds the SPDP25D28-1 I

simply a matter of determining the maximum temperature rise of the application and deciding whether or not the

wire will be in a bundle and use the information above. Similarly, the I

SPDP05D28-1 are 1.72 x 10

Application Connections

The SPDPXXD28-1 Series may be configured as a high-side or low-side switch and may be used in positive or

negative supply applications.

Figure 6 – High-Side Switch, Positive Supply

Figure 6 shows the connections as a high-side switch with a positive power supply.