For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

8

8 - 23

Outline Drawing

Absolute Maximum Ratings

Collector Bias Voltage (Vcc)

+7V

RF Input Power (RFIN)(Vcc = +3.9V)

+10 dBm

Junction Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 5.21 mW/°C above 85 °C)

0.34 W

Thermal Resistance

(junction to lead)

191 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC311ST89

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H311

XXXX

HMC311ST89E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H311

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

NOTES:

1. PACKAGE BODY MATERIAL:

MOLDING COMPOUND MP-180S OR EQUIVALENT.

2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING.

3. LEAD PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS]

5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC311ST89 / 311ST89E

v03.0710

InGaP HBT GAIN BLOCK

MMIC AMPLIFIER, DC - 6 GHz