1.5A Ultra Low Dropout Linear Regulator

TJ3965

Jul. 2010 – Rev. 1.12

- 11 -

HTC

Characteristic

Symbol

Rating

Unit

Thermal Resistance Junction-To-Ambient / MSOP8

220

°C/W

Thermal Resistance Junction-To-Ambient / SOP8

165

°C/W

Thermal Resistance Junction-To-Ambient / SOP8-PP

175

°C/W

Thermal Resistance Junction-To-Ambient / SOT223

140

°C/W

Thermal Resistance Junction-To-Ambient / TO252

105

°C/W

Thermal Resistance Junction-To-Ambient / TO263

80

°C/W

Thermal Resistance Junction-To-Ambient / TO220

70

°C/W

Thermal Resistance Junction-To-Ambient / SOT89

200

°C/W

In case that there is no cooling solution and no heat sink / copper plane area for heat sink, the maximum

allowable power dissipation of each package is as follow;

Characteristic

Symbol

Rating

Unit

0.455

W

0.606

W

0.571

W

0.714

W

0.952

W

1.250

W

1.429

W

0.500

W

- Please note that above maximum allowable power dissipation is based on the minimum copper

plane area which does not exceed the proper footprint of the package. And the ambient

If proper cooling solution such as heat sink, copper plane area, air flow is applied, the maximum

allowable power dissipation could be increased. However, if the ambient temperature is increased, the

allowable power dissipation would be decreased.

the specification of maximum power dissipation for an application is fixed, the proper copper plane area