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TJ3965MD-1.8V-8L Datasheet(PDF) 11 Page - HTC Korea TAEJIN Technology Co. |
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TJ3965MD-1.8V-8L Datasheet(HTML) 11 Page - HTC Korea TAEJIN Technology Co. |
11 / 12 page 1.5A Ultra Low Dropout Linear Regulator TJ3965 Jul. 2010 – Rev. 1.12 - 11 - HTC Characteristic Symbol Rating Unit Thermal Resistance Junction-To-Ambient / MSOP8 θJA-MSOP8 220 °C/W Thermal Resistance Junction-To-Ambient / SOP8 θJA-SOP8 165 °C/W Thermal Resistance Junction-To-Ambient / SOP8-PP θJA-SOP8-PP 175 °C/W Thermal Resistance Junction-To-Ambient / SOT223 θJA-SOT223 140 °C/W Thermal Resistance Junction-To-Ambient / TO252 θJA-TO252 105 °C/W Thermal Resistance Junction-To-Ambient / TO263 θJA-TO263 80 °C/W Thermal Resistance Junction-To-Ambient / TO220 θJA-TO220 70 °C/W Thermal Resistance Junction-To-Ambient / SOT89 θJA-SOT89 200 °C/W In case that there is no cooling solution and no heat sink / copper plane area for heat sink, the maximum allowable power dissipation of each package is as follow; Characteristic Symbol Rating Unit Maximum Allowable Power Dissipation at TA=25°C / MSOP8 PDMax-MSOP8 0.455 W Maximum Allowable Power Dissipation at TA=25°C / SOP8 PDMax -SOP8 0.606 W Maximum Allowable Power Dissipation at TA=25°C / SOP8-PP PDMax -SOP8-PP 0.571 W Maximum Allowable Power Dissipation at TA=25°C / SOT223 PDMax -SOT223 0.714 W Maximum Allowable Power Dissipation at TA=25°C / TO252 PDMax -TO252 0.952 W Maximum Allowable Power Dissipation at TA=25°C / TO263 PDMax -TO263 1.250 W Maximum Allowable Power Dissipation at TA=25°C / TO220 PDMax -TO220 1.429 W Maximum Allowable Power Dissipation at TA=25°C / SOT89 PDMax –SOT89 0.500 W - Please note that above maximum allowable power dissipation is based on the minimum copper plane area which does not exceed the proper footprint of the package. And the ambient temperature is 25°C. If proper cooling solution such as heat sink, copper plane area, air flow is applied, the maximum allowable power dissipation could be increased. However, if the ambient temperature is increased, the allowable power dissipation would be decreased. For example, in case of SOT223 and TO263 package, θJA-SOT223 is 140 °C/W and θJA-TO263 is 80 °C/W, however, as shown in below graph, θJA could be decreased with respect to the copper plane area. So, the specification of maximum power dissipation for an application is fixed, the proper copper plane area could be estimated by following graphs. As shown in graph, wider copper plane area leads lower θJA. |
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