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TJ3964D-2.5 Datasheet(PDF) 10 Page - HTC Korea TAEJIN Technology Co. |
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TJ3964D-2.5 Datasheet(HTML) 10 Page - HTC Korea TAEJIN Technology Co. |
10 / 11 page 1A Ultra Low Dropout Linear Regulator TJ3964 Dec. 2009 – Rev. 1.1 - 10 - HTC Table. 1. Absolute Maximum Ratings of Thermal Resistance No heat sink / No air flow / No adjacent heat source / TA = 25°C Characteristic Symbol Rating Unit Thermal Resistance Junction-To-Ambient / SOT23-5 θJA-SOT23-5 265 °C/W Thermal Resistance Junction-To-Ambient / SOP-8 θJA-SOP-8 165 °C/W Thermal Resistance Junction-To-Ambient / SOT223 θJA-SOT223 140 °C/W Thermal Resistance Junction-To-Ambient / TO252 θJA-TO252 105 °C/W In case that there is no cooling solution and no heat sink / minimum copper plane area for heat sink, the maximum allowable power dissipation of each package is as follow; Characteristic Symbol Rating Unit Maximum Allowable Power Dissipation at TA=25°C / SOT23-5 PDMax-SOT23-5 0.378 W Maximum Allowable Power Dissipation at TA=25°C / SOP-8 PDMax-SOP-8 0.606 W Maximum Allowable Power Dissipation at TA=25°C / SOT223 PDMax-SOT223 0.714 W Maximum Allowable Power Dissipation at TA=25°C / TO252 PDMax-TO252 0.952 W - Please note that above maximum allowable power dissipation is based on the minimum copper plane area which does not exceed the proper footprint of the package. And the ambient temperature is 25°C. If proper cooling solution such as heat sink, copper plane area, air flow is applied, the maximum allowable power dissipation could be increased. However, if the ambient temperature is increased, the allowable power dissipation would be decreased. For example, in case of SOT-223 and TO-252 package, θJA-SOT223 is 140 °C/W and θJA-TO52 is 105 °C/W, however, as shown in below graph, θJA could be decreased with respect to the copper plane area. So, the specification of maximum power dissipation for an application is fixed, the proper copper plane area could be estimated by following graphs. As shown in graph, wider copper plane area leads lower θJA. Junction To Ambient Thermal Resistance, θJA vs. 1 ounce Copper Area [SOT-223 Package] Junction To Ambient Thermal Resistance, θJA vs. 2 ounce Copper Area [TO-252 Package] |
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