Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Reflow Profile

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.

Recommended Pad Layout

Thermal Resistance vs Additional PCB Cu Area

Added Cu Area (Sq. In.)

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

120

100

80

60

40

20

0

finish. For improved thermal dissipation, the recommended layout

uses PCB copper areas which extend beyond the exposed solder

pad. The exposed solder pads should be defined by a solder mask

spacing. It is recommended that they should be the same dimen-

more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width

sizes to ensure adequate clearance is maintained. The recom-

mended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a

stencil opening size 0.025 mm (0.0010 in.) less than the solder pad

size. Extended copper areas beyond the solder pad significantly

improve the junction to ambient thermal resistance, resulting in

operation at lower junction temperatures with a corresponding

benefit of reliability. All pads should soldered to the PCB, includ-

ing pads marked as NC or NU but no electrical connection should

be made to these pads. For minimum parasitic capacitance, it is

recommended that signal, ground or power signals are not routed

beneath any pad.

Dark grey areas show added PCB copper area for better

thermal resistance.

54

3

2

1

54

2

31