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TBU-CX065-VTC-WH Datasheet(PDF) 4 Page - Bourns Electronic Solutions |
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TBU-CX065-VTC-WH Datasheet(HTML) 4 Page - Bourns Electronic Solutions |
4 / 5 page Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU-CX Series - TBU® High-Speed Protectors Reflow Profile Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max. Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) 150 °C 200 °C 60-180 sec. Time maintained above: - Temperature (TL) - Time (tL) 217 °C 60-150 sec. Peak/Classification Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec. Ramp-Down Rate 6 °C/sec. max. Time 25 °C to Peak Temperature 8 min. max. Recommended Pad Layout Thermal Resistance vs Additional PCB Cu Area Added Cu Area (Sq. In.) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 120 100 80 60 40 20 0 TBU® High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimen- sion as the TBU® pads but if smaller solder pads are used, they should be centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recom- mended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, includ- ing pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. Dark grey areas show added PCB copper area for better thermal resistance. 54 3 2 1 54 2 31 |
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