MC74HCT157A

High–Speed CMOS Logic Data

DL129 — Rev 6

5

MOTOROLA

OUTLINE DIMENSIONS

N SUFFIX

PLASTIC PACKAGE

CASE 648–08

ISSUE R

MIN

MIN

MAX

MAX

INCHES

MILLIMETERS

DIM

A

B

C

D

F

G

H

J

K

L

M

S

18.80

6.35

3.69

0.39

1.02

0.21

2.80

7.50

0

°

0.51

19.55

6.85

4.44

0.53

1.77

0.38

3.30

7.74

10

°

1.01

0.740

0.250

0.145

0.015

0.040

0.008

0.110

0.295

0

°

0.020

0.770

0.270

0.175

0.021

0.070

0.015

0.130

0.305

10

°

0.040

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

2.54 BSC

1.27 BSC

0.100 BSC

0.050 BSC

–A

–

B

18

9

16

F

H

G

S

C

–T

–

SEATING

PLANE

K

J

M

L

TA

M

0.25 (0.010)

T

B

A

M

S

S

MIN

MIN

MAX

MAX

MILLIMETERS

INCHES

DIM

A

B

C

D

F

G

J

K

M

P

R

9.80

3.80

1.35

0.35

0.40

0.19

0.10

0

°

5.80

0.25

10.00

4.00

1.75

0.49

1.25

0.25

0.25

7

°

6.20

0.50

0.386

0.150

0.054

0.014

0.016

0.008

0.004

0

°

0.229

0.010

0.393

0.157

0.068

0.019

0.049

0.009

0.009

7

°

0.244

0.019

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

1

8

9

16

–A

–

–B

–

K

C

G

–T

–

SEATING

PLANE

°

M

J

F

0.25 (0.010)

B

M

M

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

ISSUE J

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MC74HCT157A/D

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