For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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11 - 246

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO

PCB RF GROUND.

InGaP HBT 1 WATT POWER

AMPLIFIER, 1.7 - 2.2 GHz

v03.0907

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC457QS16G

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H457

XXXX

HMC457QS16GE

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H457

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information