For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

11

11 - 256

Evaluation PCB

The circuit board used in the final application should

use RF circuit design techniques. Signal lines

should have 50 ohm impedance while the package

ground leads and exposed paddle should be con-

nected directly to the ground plane similar to that

shown. A sufficient number of via holes should be

used to connect the top and bottom ground planes.

The evaluation board should be mounted to an

appropriate heat sink. The evaluation circuit board

shown is available from Hittite upon request.

Item

Description

J1, J2

PCB Mount SMA Connector

J3, J4

2 mm DC Header

C1, C2

2.2 μF Capacitor, Tantalum

C3, C4

100 pF Capacitor, 0402 Pkg.

C5, C6

5 pF Capacitor, 0402 Pkg.

C7, C8

0.8 pF Capacitor, 0402 Pkg.

C9, C10

4 pF Capacitor, 0402 Pkg.

L1, L2

8.2 nH Inductor, 0402 Pkg.

U1

HMC461LP3 / HMC461LP3E

Power Amplifier

U2, U3

Panasonic Balun, P/N EHFFD - 1619

106483 Evaluation PCB, 10 mils

[1] Reference this number when ordering complete evaluation PCB

[2] Circuit Board Material: Rogers 4350, Er = 3.48

Pin Number

Description

1, 2, 3

GND

4, 5, 6

Vs

J3, J4

Specifications and data reflect HMC461LP3 measured with external baluns in a balanced

amplifier configuration optimized for 1.85 - 2.2 GHz per application circuit herein.

Contact HMC Applications for 1.7 - 1.85 GHz performance optimization.

InGaP HBT 1 Watt High IP3

AMPLIFIER, 1.7 - 2.2 GHz

v02.0705