Micrel, Inc.

MIC28500

June 2011

9

M9999-060311-B

Typical Characteristics (Continued)

vs. Output Current

0

20

40

60

80

012

34

OUTPUT CURRENT (A)

vs. Output Current

0

20

40

60

80

01

23

4

OUTPUT CURRENT (A)

vs. Output Current

0

20

40

60

80

100

01

23

4

OUTPUT CURRENT (A)

vs. Output Current

30

40

50

60

70

80

90

100

01

23

456

OUTPUT CURRENT (A)

5.0V

3.3V

2.5V

1.8V

1.5V

1.2V

1.0V

0.9V

0.8V

vs. Output Current

10

20

30

40

50

60

70

80

90

100

012

3456

OUTPUT CURRENT (A)

5.0V

3.3V

2.5V

1.8V

1.5V

1.2V

1.0V

0.9V

0.8V

vs. Output Current

10

20

30

40

50

60

70

80

90

100

0

12

3456

OUTPUT CURRENT (A)

5.0V

3.3V

2.5V

1.8V

1.5V

1.2V

1.0V

0.9V

0.8V

Thermal Derating

0

1

2

3

4

25

40

55

70

85

100

Maximum Ambient Temperature (°C)

L=10uH

Thermal Derating

0

1

2

3

4

25

40

55

70

85

100

Maximum Ambient Temperature (°C)

L=10uH

Thermal Derating

0

1

2

3

4

25

40

55

70

85

100

Maximum Ambient Temperature (°C)

L=33μH

Die Temperature* :

The temperature measurement was taken at the hottest point on the MIC28500 case mounted on a 5 square inch 4 layer, 0.62”,

FR-4 PCB with 2oz. finish copper weight per layer, see Thermal Measurement section. Actual results will depend upon the size of the PCB, ambient

temperature and proximity to other heat emitting components.