3

3 - 91

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

MxN Spurious Outputs

nLO

mRF

0

1234

0

xx

-13

27

xx

xx

1180

35

52

xx

276

74

87

74

82

3

xx

83877787

4xx

xx

82

87

87

RF = 24.5 GHz @ -10 dBm

LO = 24.4 GHz @ 17 dBm

Data taken without IF hybrid

All values in dBc below IF power level

Absolute Maximum Ratings

RF / IF Input

+13 dBm

LO Drive

+27 dBm

Channel Temperature

150°C

Continuous Pdiss (T=85°C)

(derate 9.8 mW/°C above 85°C)

641 mW

Thermal Resistance (R

TH

)

(junction to die bottom)

102 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 deg °C

ESD Sensitivity (HBM)

Class 1A

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004”

4. BACKSIDE METALIZATION: GOLD

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

8. OVERALL DIE SIZE ±.002”

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC524

v02.0907

GaAs MMIC I/Q MIXER

22 - 32 GHz