5

5 - 5

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

HMC913

v01.0810

SUCCESSIVE DETECTION LOG VIDEO

AMPLIFIER (SDLVA), 0.6 - 20 GHz

Outline Drawing

NOTES:

1. ALL DIMENSIONS IN INCHES [MILLIMETERS]

2. DIE THICKNESS IS 0.011 (0.279)

3. TYPICAL BOND PAD IS 0.0024 SQUARE

4. BOND PAD METALLIZATION: ALUMINUM

5. NO BACKSIDE METAL

6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS

7. OVERALL DIE SIZE IS ±.002

Standard

Alternate

WP-3 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

Absolute Maximum Ratings

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Vcc

+3.6V

ENBL

+3.6V

RF Input Power

+15 dBm

Channel Temperature

125 °C

Continuous Pdiss (T=85°C)

Derate 12.63 mW/°C above 85°C

0.51 W

Thermal Resistance R

th

(Junction to die bottom)

79.2 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

ESD Sensitivity (HBM)

Class 1A