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HMC950 Datasheet(PDF) 6 Page - Hittite Microwave Corporation |
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HMC950 Datasheet(HTML) 6 Page - Hittite Microwave Corporation |
6 / 10 page 3 3 - 6 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com HMC950 v03.0611 GaAs pHEMT MMIC 4 WATT POWER AMPLIFIER, 12 - 16 GHz Outline Drawing noTes: 1. All Dimensions Are in inChes [mm] 2. Die ThiCKness is .004” 3. TYpiCAl BonD pAD is .004” sQUAre 4. BACKsiDe meTAlliZATion: GolD 5. BonD pAD meTAlliZATion: GolD 6. BACKsiDe meTAl is GroUnD. 7. ConneCTion noT reQUireD for UnlABeleD BonD pADs. 8. oVerAll Die siZe ± .002 Die Packaging Information [1] standard Alternate Gp-1 (Gel pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. |
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