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HMC-AUH232 Datasheet(PDF) 5 Page - Hittite Microwave Corporation |
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HMC-AUH232 Datasheet(HTML) 5 Page - Hittite Microwave Corporation |
5 / 10 page 4 4 - 6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Outline Drawing NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002” Die Packaging Information [1] Standard Alternate GP-1 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. HMC-AUH232 v02.0209 GaAs HEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 43 GHz |
Similar Part No. - HMC-AUH232_09 |
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Similar Description - HMC-AUH232_09 |
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