CNY64AYST, CNY64ABST, CNY64AGRST, CNY65AYST, CNY65ABST, CNY65AGRST

www.vishay.com

Vishay Semiconductors

Rev. 1.0, 20-Sep-11

7

Document Number: 82387

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

SOLDERING GUIDLINES

Soldering Condition

The CNY64AxST, CNY65AxST are lead (Pb)-free devices.

They are suitable for reflow soldering. However due to large

package size, the peak package body temperature should

not go above 245 °C.

Drypack

Devices are packed in moisture barrier bags (MBB) to

prevent moisture absorption during transportation and

storage. Each bag contains a desiccant bag.

Floor Life

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 72 h

Moisture sensitivity level 4, according to J-STD-020.

Drying

In case of moisture absorption devices should be baked

before soldering according to the recommended conditions

shown below

48 h at 125 °C ± 5 °C, RH < 5%

(Not suitable for tape and reel)

In case the floor time has not exceeded 10 days the units

can be baked in tape and reel according to the following

conditions

168 h at 60 °C ± 5 °C, RH < 5 %

(Not suitable, if the floor time was exceeded by more than

10 days, or the allowed factory condition is exceeded)

PACKAGE DIMENSIONS in millimeters FOR CNY64AxxxST

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 120 s

max. 100 s

217 °C

max. 20 s

max. ramp up 3 °C/s

max. ramp down 6 °C/s

max. 2 cycles allowed

22550

Cathode

Emitter

Anode

Collector

5.08 ± 0.4

9

15.9

Recommended footprint

specifications

according to DIN

technical drawings

7.2 ± 0.2

14.4 ± 0.3

12.8 ± 0.2

0.5 ± 0.2

2.1 ± 0.5

Leads coplanarity

0.1 max.

Z

Z 10:1

6.544-5406.01-4