prel

imin

ary

prel

imin

ary

iC-HG

3 A LASER SWITCH

Rev A2, Page 3/21

PACKAGES QFN28 5 mm x 5 mm to JEDEC

PIN CONFIGURATION QFN28 5 mm x 5 mm

HG

code...

...

1

2

3

4

5

9

10

11

12

13

18

19

20

21

25

26

27

28

14

16

17

23

24

6

7

8

15

22

PIN FUNCTIONS

No. Name

Function

1 CI1

Current control voltage channel 1

2 CI2

Current control voltage channel 2

3 CI3

Current control voltage channel 3

4 GND

Ground

5 CI4

Current control voltage channel 4

6 CI5

Current control voltage channel 5

7 CI6

Current control voltage channel 6

8 AGND6 Analog ground channel 6

9 LDK6

Laser diode cathode channel 6

10 AGND5 Analog ground channel 5

11 LDK5

Laser diode cathode channel 5

12 AGND4 Analog ground channel 4

13 LDK4

Laser diode cathode channel 4

14 EN6

TTL switching input channel 6

Negative LVDS Input channel 5 and 6

15 EN5

TTL switching input channel 5

Positive LVDS Input channel 5 and 6

16 EN4

TTL switching input channel 4

Negative LVDS Input channel 3 and 4

17 EN3

TTL switching input channel 3

Positive LVDS Input channel 3 and 4

18 VDD

Supply voltage

19 ELVDS TTL/LVDS Fast/Slow Input selector

20 EN2

TTL switching input channel 2

Negative LVDS Input channel 1 and 2

21 EN1

TTL switching input channel 1

Positive LVDS Input channel 1 and 2

22 NER

Error monitor output

23 LDK3

Laser diode cathode channel 3

24 AGND3 Analog ground channel 3

25 LDK2

Laser diode cathode channel 2

26 AGND2 Analog ground channel 2

27 LDK1

Laser diode cathode channel 1

28 AGND1 Analog ground channel 1

The Thermal Pad is to be connected to a Ground Plane (GND, AGND1. . . 6) on the PCB.

Only pin 1 marking on top or bottom defines the package orientation (

HG label and coding is subject

to change).