LV8762T

No.A1926-4/13

Substrate Specifications

(Substrate recommended for operation of LV8762T)

Size

: 57mm × 57mm × 1.6mm (two-layer substrate)

Material

: Glass epoxy both-type board

L1 : Copper wiring pattern diagram

L2 : Copper wiring pattern diagram

Cautions

1) For the set design, employ the derating design with sufficient margin.

Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as

vibration, impact, and tension.

Accordingly, the design must ensure these stresses to be as low or small as possible.

The guideline for ordinary derating is shown below :

(1)Maximum value 80% or less for the voltage rating

(2)Maximum value 80% or less for the current rating

(3)Maximum value 80% or less for the temperature rating

2) After the set design, be sure to verify the design with the actual product.

Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.

Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,

possibly resulting in thermal destruction of IC.

0

1.0

1.5

0.5

2.0

1.40

0.73

40

60

80

20

0

100

Ambient temperature, Ta -

C