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EMIF06-MSD02N16 Datasheet(PDF) 11 Page - STMicroelectronics |
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EMIF06-MSD02N16 Datasheet(HTML) 11 Page - STMicroelectronics |
11 / 12 page EMIF06-MSD02N16 Ordering information 11/12 5.5 Reflow profile Figure 18. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. 6 Ordering information 7 Revision history 0 01 2345 67 Time (min) Temperature (°C) 2°C/s recommended 6°C/s max 220°C 125 °C 260°C max 255°C 180°C 90 sec max 10-30 sec 90 to 150 sec 3°C/s max 0 01 2345 67 Time (min) Temperature (°C) 2°C/s recommended 6°C/s max 220°C 125 °C 260°C max 255°C 180°C 90 sec max 10-30 sec 90 to 150 sec 3°C/s max Table 4. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF06-MSDN16 N6(1) 1. The marking can be rotated by 90° to differentiate assembly location Micro QFN 6.17 mg 3000 Tape and reel (7”) Table 5. Document revision history Date Revision Changes 21-Nov-2008 1 Initial release. |
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