www.vishay.com

Document Number: 28747

6

Revision: 06-May-10

MFU Series

Vishay Beyschlag

Thin Film Chip Fuses

DESCRIPTION

Production is strictly controlled and follows an extensive

set

of

instructions

established

for

reproducibility.

A

homogeneous film of metal alloy is deposited on a high

grade ceramic body. The fuse elements are covered by a

protective coating designed for electrical, mechanical and

climatic protection. The terminations receive a final pure tin

on nickel plating.

The result of the determined production is verified by an

extensive testing procedure performed on 100 % of the

individual fuses. Only accepted products are laid directly

into the paper tape in accordance with IEC 60286-3.

APPROVALS

The fuses are tested in accordance with IEC 60127-4 and

UL 248-14 which refers to UL 248-1, IEC 60127-1 and

IEC 60068 series. Approval of conformity is indicated by the

UMF logo on the package label. Recognition by Underwriter

Laboratories Inc. is indicated by the UL logo on the package

label.

ASSEMBLY

The fuses are suitable for processing on automatic SMD

assembly

systems.

They

are

suitable

for

automatic

soldering using wave, reflow or vapour phase. The

encapsulation is resistant to all cleaning solvents commonly

used in the electronics industry, including alcohols, esters

and aqueous solutions. The fuses are RoHS compliant, the

pure tin plating provides compatibility with lead (Pb)-free

and lead-containing soldering processes. The immunity of

the plating against tin whisker growth has been proven

under extensive testing. Solderability is specified for 2 years

after production or re-qualification. The permitted storage

time is 20 years.

All products comply with the CEFIC-EECA-EICTA list of legal

restrictions on hazardous substances.

This includes full compliance with the following directives:

• 2000/53/EC End of Vehicle life Directive (ELV) and

Annex II (ELV II)

• 2002/95/EC Restriction of the use of Hazardous

Substances Directive (RoHS)

• 2002/96/EC Waste Electrical and Electronic Equipment

Directive (WEEE)

FUNCTIONAL PERFORMANCE

Note

Lead (Pb)-free Identification

on the Package Label

e3

- 60

150

0

50

60

70

80

90

100

110

120

MFU Series

75

90

105

120

135

ϑ

40

30

20

10

- 45

- 30

- 15

0

15

30

45

60