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MFU1206FF01000P100 Datasheet(PDF) 11 Page - Vishay Siliconix |
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MFU1206FF01000P100 Datasheet(HTML) 11 Page - Vishay Siliconix |
11 / 13 page Document Number: 28747 For technical questions, contact: thinfilm.chipfuse@vishay.com www.vishay.com Revision: 06-May-10 11 MFU Series Thin Film Chip Fuses Vishay Beyschlag TEST AND REQUIREMENTS All tests are carried out in accordance with the following specifications: IEC 60127-1, Miniature fuse - Part 1: Definitions for miniature fuses and general requirements for miniature fuse-links IEC 60127-4, Universal Modular Fuse Links (UMF) UL 248-1, Low voltage fuses - Part 1: General requirements UL 248-14, Low voltage fuses - Part 14: Supplemental fuses For the full test schedule refer to the documents listed above. The testing also covers most of the requirements specified by METI and CCC. The tests are carried out in accordance with IEC 60068 and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. Unless otherwise specified the following values apply: Temperature: 15 °C to 35 °C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). The components are mounted for testing on printed-circuit boards in accordance with IEC 60127-4, unless otherwise specified. The requirements stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of IEC 60127-1 and IEC 60127-4 respectively. However, some additional tests and a number of improvements against those minimum requirements have been included. TEST PROCEDURES AND REQUIREMENTS IEC 60127-4 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE 8.3.2 21 (Ue1) Substrate bending Depth 1 mm; rate 1 mm/s 1 times No visible damage ΔR/R ≤ ± 10 % 8.6.2 58 (Td) Solderability Solder bath method; SnPb40; non-activated flux; (215 ± 3) °C; (3 ± 0.3) s Good tinning ( ≥ 95 % covered); no visible damage Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux; (245 ± 3) °C; (2 ± 0.2) s Good tinning ( ≥ 95 % covered); no visible damage 8.7.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s No visible damage ΔR/R ≤ ± 10 % Reflow method 2 (IR/forced gas convection); (260 ± 5) °C; (10 ± 1) s No visible damage ΔR/R ≤ ± 10 % 9.2.1 - Time/current characteristics at nominal temperature Cold resistance at 0.1 x IR; destructive testing under overcurrent conditions (DC-Current) MFU 0402 IR ≤ 0.75 A At 1.25 x IR, tpre-arc > 1 h at 2.0 x IR, tpre-arc < 60 s at 10 x IR, tpre-arc < 0.001 s MFU 0402 0.8 A ≤ IR ≤ 3.15 A At 1.25 x IR, tpre-arc > 1 h at 2.0 x IR, tpre-arc < 5 s at 10 x IR, tpre-arc < 0.001 s MFU 0603 IR ≤ 5.0 A MFU 0805 IR ≤ 5.0 A MFU 1206 IR ≤ 6.3 A 9.3.2 - Breaking capacity 50 A at rated voltage acc. to UL 248-14 Optical inspection with naked eye no visible damage 9.3.3 - Residual resistance 50 A at rated voltage acc. to UL 248-14 Insulation resistance at 2.0 x UR (DC) higher than 0.1 M Ω |
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