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HI-3588PQT Datasheet(PDF) 11 Page - Holt Integrated Circuits |
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HI-3588PQT Datasheet(HTML) 11 Page - Holt Integrated Circuits |
11 / 11 page HI-3588 PACKAGE DIMENSIONS 44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN) Package Type: 44PCS BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) .203 ± .006 (5.15 ± .15) .016 ± .002 (0.40 ± .05) .010 (0.25) .020 (0.50) .008 (0.2) .039 (1.00) .276 (7.00) BSC .203 ± .006 (5.15 ± .15) typ typ Bottom View Top View BSC .276 (7.00) BSC max inches (millimeters) Heat sink pad on bottom of package. Heat sink must be left floating or connected to VDD. DO NOT connect to GND. Package Type: 0 ° £ Q £ 7° Detail A See Detail A SQ. 44PTQS 44-PIN PLASTIC QUAD FLAT PACK (PQFP) .006 (.15) .547 ± .010 (13.90 ± .25) .394 ± .004 (10.0 ± .10) SQ. MAX. .014 ± ..002 (.35 ± .05) .035 .006 ± (.88 .15) ± .005 (.13) R MIN. .012 (.30) R MAX. .055 .002 ± (1.4 .05) ± .063 (1.6) MAX. .0315 (.80) inches (millimeters) BSC BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 11 |
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