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HI-8190PSM Datasheet(PDF) 8 Page - Holt Integrated Circuits |
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HI-8190PSM Datasheet(HTML) 8 Page - Holt Integrated Circuits |
8 / 9 page HI-8190 PACKAGE DIMENSIONS 16-PIN PLASTIC CHIP-SCALE PACKAGE millimeters Package Type: 16PCS1 BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) Top View Bottom View Electrically isolated metal heat sink on bottom of package Connect to any ground or power plane for optimum thermal dissipation 16-PIN PLASTIC SMALL OUTLINE (SOIC) - NB (Narrow Body) inches (millimeters) Package Type: 16HN BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) 0 ° to 8° Detail A .0069 ± .0029 (.176 ± .074) .033 ± .017 (.838 ± .432) .061 ± .007 (1.549 ± .178) .0165 ± .003 (.419 ± .089) .390 ± .004 (9.90 ± .10) .236 ±.008 (5.99 ±.20) .0087 ± .0012 (.220 ± .029) See Detail A .1525 ± .0025 (3.87 ± .06) Top View .050 (1.27) BSC 5.00 ± 0.05 (0.197 ± 0.002) 3.38 ± 0.05 (0.133 ± 0.002) 0.75 ± 0.05 (0.03 ± 0.002) 0.025 ± 0.025 (0.001 ± 0.001) 0.203 (0.008) REF. 0.80 (0.031) BSC 0.30 0.012 ± 0.05 ( ± 0.002) .50 ± 0.05 (0.020 ± 0.002) 0.20 (0.008) min. HOLT INTEGRATED CIRCUITS 8 |
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