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MAX16021 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX16021 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 21 page Low-Power µP Supervisory Circuits with Battery-Backup Circuit and Chip-Enable Gating 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VCC = 1.53V to 5.5V, VBATT = 3V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VCC, BATT, OUT, BATT_TEST to GND.....................-0.3V to +6V RESET, RESET, PFO, BATTOK, WDO, BATTON, BATT_TEST, LL, (all open-drain) to GND .................-0.3V to +6V RESET, RESET, BATTOK, WDO, BATTON, LL (all push-pull) to GND......................-0.3V to (VOUT + 0.3V) WDI, PFI to GND.......................................-0.3V to (VOUT + 0.3V) CEIN, CEOUT to GND ..............................-0.3V to (VOUT + 0.3V) MR to GND .................................................-0.3V to (VCC + 0.3V) Input Current VCC Peak Current.................................................................1A VCC Continuous Current ...............................................250mA BATT Peak Current .......................................................500mA BATT Continuous Current ...............................................70mA Output Current OUT Short Circuit to GND Duration ....................................10s RESET, RESET, BATTON ....................................................20mA Continuous Power Dissipation (TA = +70°C) 10-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW 16-Pin TQFN (derate 25mW/°C above +70°C) ..........2000mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) TDFN ............................................................................+260°C TQFN............................................................................+240°C PACKAGE THERMAL CHARACTERISTICS (Note 1) TDFN Junction-to Ambient Thermal Resistance ( θJA) ...........41°C/W Junction-to Case Thermal Resistance ( θJC) ..................9°C/W TQFN Junction-to Ambient Thermal Resistance ( θJA) ...........40°C/W Junction-to Case Thermal Resistance ( θJC) ..................6°C/W PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Voltage Range (Note 3) VCC, VBATT VCC or VBATT > VTH 0 5.5 V VCC = 1.62V 1.2 2 VCC = 2.8V 1.9 3 VCC = 3.6V 2.3 3.5 Supply Current ICC VCC > VTH VCC = 5.5V 3.4 5 µA Supply Current in Battery-Backup Mode IBATT VCC = 0V 0.25 0.5 µA VCC Switchover Threshold Voltage VCC rising, VCC - VBATT 0.1 x VCC V BATT Switchover Threshold Voltage VCC falling, VCC < VTH, VCC - VBATT 0mV BATT Standby Current VCC > VBATT + 0.2V -10 +10 nA BATT Freshness Leakage Current VBATT = 5.5V 20 nA VCC = 4.75V, IOUT = 150mA 1.4 4.5 VCC = 3.15V, IOUT = 65mA 1.7 4.5 VCC = 2.35V, IOUT = 25mA 2.1 5.0 VCC to OUT On-Resistance RON VCC = 1.91V, IOUT = 10mA 2.6 5.5 Ω VBATT = 4.5V, IOUT = 20mA VBATT - 0.1 Output Voltage in Battery-Backup Mode VOUT VBATT = 2.5V, IOUT = 20mA VBATT - 0.15 V Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. |
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