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MAX44252 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX44252 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 15 page ����������������������������������������������������������������� Maxim Integrated Products 2 MAX44251/MAX44252 20V, Ultra-Precision, Low-Noise Op Amps Supply Voltage (VDD to VSS).................................-0.3V to +22V All Other Pins..................................(VSS - 0.3V) to (VDD + 0.3V) Short-Circuit Duration to Either Supply Rail ............................ 1s Continuous Input Current (any pin)................................. ±20mA Differential Input Voltage...................................................... ±6V Maximum Power Dissipation (TA = +70°C) SOT23 (derate 9.1 mW/°C above +70°C)...................727mW µMAX (derate 4.5 mW/°C above +70°C) ....................362mW SOIC (derate 8.3 mW/°C above +70°C) ..................666.7mW Operating Temperature Range........................ -40°C to +125NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65°C to +150NC Lead Temperature (soldering, 10s) .............................. +300NC Soldering Temperature (reflow) .................................... +260NC SOT23 Junction-to-Ambient Thermal Resistance (ΘJA) ....... 196°C/W Junction-to-Case Thermal Resistance (ΘJC) ...............70°C/W µMAX Junction-to-Ambient Thermal Resistance (ΘJA) ........221°C/W Junction-to-Case Thermal Resistance (ΘJC) ...............42°C/W SOIC Junction-to-Ambient Thermal Resistance (ΘJA) ........120°C/W Junction-to-Case Thermal Resistance (ΘJC) ...............37°C/W ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) ELECTRICAL CHARACTERISTICS (VDD = 10V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, TA = -40°C to +125°C, unless otherwise noted. Typical values are at +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Supply Voltage Range VDD Guaranteed by PSRR 2.7 20 V Power-Supply Rejection Ratio (Note 3) PSRR VDD = 2.7V to 20V, VCM = 0V 140 145 dB Quiescent Current per Amplifier IDD RL = J TA = +25NC 1.15 1.55 mA -40NC < TA < +125NC 1.75 Power-Up Time tON 25 F s DC SPECIFICATIONS Input Common-Mode Range VCM Guaranteed by CMRR test VSS - 0.05 VDD - 1.5 V Common-Mode Rejection Ratio (Note 3) CMRR TA = +25NC, VCM = -0.05V to (VDD - 1.5V) 133 140 dB -40NC < TA < +125NC 130 |
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