Notes:

1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062").

2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.

3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms,C=30nF.

4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms,C=10nF. Data not presented forC=30nF

as this is considered unrealistic for high speed operation.

5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB.

6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB.

7. Similar results would be obtained with TXAOUT shorted to TXBOUT.

8. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.

9. Data will vary depending on air flow and the method of heat sinking employed.

10. Current values are per supply.

PACKAGE THERMAL CHARACTERISTICS

SUPPLY CURRENT (mA)

2

JUNCTION TEMP, Tj (°C)

Ta = 25

Ta=125

Ta=125

Low Speed

3

16.8

17.2

16.9

58

116

157

High Speed

4

27.3

26.7

25.9

75

132

169

Low Speed

17.4

17.5

16.9

68

126

166

High Speed

27.6

27.1

25.9

97

147

186

Low Speed

17.1

17.2

16.7

52

110

151

High Speed

27.3

27.1

26.2

57

112

157

SUPPLY CURRENT (mA)

2

JUNCTION TEMP, Tj (°C)

Ta = 25

Ta=125

Ta=125

Low Speed

3

53.6

50.7

52.2

131

181

217

High Speed

4

46.9

38.7

42.5

135

181

219

Low Speed

46.4

47.6

68.1

167

191

221

High Speed

42.1

43.8

67.1

177

212

223

Low Speed

48.5

45.6

46.1

112

161

186

High Speed

46.8

41.1

40.5

116

168

197

MAXIMUM ARINC LOAD

9, 10

TXAOUT and TXBOUT Shorted to Ground

7, 8, 9, 10

8 Lead Plastic ESOIC

5

8 Lead Plastic ESOIC

6

ARINC 429

DATA RATE

ARINC 429

DATA RATE

PACKAGE STYLE

1

8 Lead Plastic DIP

8 Lead Plastic DIP

8 Lead Plastic ESOIC

5

8 Lead Plastic ESOIC

6

PACKAGE STYLE

1

HEAT SINK - ESOIC PACKAGES

An 8-pin thermally enhanced SOIC package is used for the

HI-8585/HI-8586 products. The ESOIC package includes

a metal heat sink located on the bottom surface of the

device. This heat sink should be soldered down to the

printed circuit board for optimum thermal dissipation. The

heat sink is electrically isolated from the chip and can be

soldered to any ground or power plane. However, since

the chip’s substrate is at V+, connecting the heat sink to

this power plane is recommended to avoid coupling noise

into the circuit.

HI-8585, HI-8586

HOLT INTEGRATED CIRCUITS

5