Electronic Components Datasheet Search |
|
HI-8585PDIF Datasheet(PDF) 5 Page - Holt Integrated Circuits |
|
HI-8585PDIF Datasheet(HTML) 5 Page - Holt Integrated Circuits |
5 / 9 page Notes: 1. All data taken in still air on devices soldered to single layer copper PCB (3" X 4.5" X .062"). 2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8. 3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms,C=30nF. 4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms,C=10nF. Data not presented forC=30nF as this is considered unrealistic for high speed operation. 5. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered to the PCB. 6. 8 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink soldered to the PCB. 7. Similar results would be obtained with TXAOUT shorted to TXBOUT. 8. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended. 9. Data will vary depending on air flow and the method of heat sinking employed. 10. Current values are per supply. PACKAGE THERMAL CHARACTERISTICS SUPPLY CURRENT (mA) 2 JUNCTION TEMP, Tj (°C) Ta = 25 oCTa = 85oC Ta=125 oCTa = 25oCTa = 85oC Ta=125 oC Low Speed 3 16.8 17.2 16.9 58 116 157 High Speed 4 27.3 26.7 25.9 75 132 169 Low Speed 17.4 17.5 16.9 68 126 166 High Speed 27.6 27.1 25.9 97 147 186 Low Speed 17.1 17.2 16.7 52 110 151 High Speed 27.3 27.1 26.2 57 112 157 SUPPLY CURRENT (mA) 2 JUNCTION TEMP, Tj (°C) Ta = 25 oCTa = 85oC Ta=125 oCTa = 25oCTa = 85oC Ta=125 oC Low Speed 3 53.6 50.7 52.2 131 181 217 High Speed 4 46.9 38.7 42.5 135 181 219 Low Speed 46.4 47.6 68.1 167 191 221 High Speed 42.1 43.8 67.1 177 212 223 Low Speed 48.5 45.6 46.1 112 161 186 High Speed 46.8 41.1 40.5 116 168 197 MAXIMUM ARINC LOAD 9, 10 TXAOUT and TXBOUT Shorted to Ground 7, 8, 9, 10 8 Lead Plastic ESOIC 5 8 Lead Plastic ESOIC 6 ARINC 429 DATA RATE ARINC 429 DATA RATE PACKAGE STYLE 1 8 Lead Plastic DIP 8 Lead Plastic DIP 8 Lead Plastic ESOIC 5 8 Lead Plastic ESOIC 6 PACKAGE STYLE 1 HEAT SINK - ESOIC PACKAGES An 8-pin thermally enhanced SOIC package is used for the HI-8585/HI-8586 products. The ESOIC package includes a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated from the chip and can be soldered to any ground or power plane. However, since the chip’s substrate is at V+, connecting the heat sink to this power plane is recommended to avoid coupling noise into the circuit. HI-8585, HI-8586 HOLT INTEGRATED CIRCUITS 5 |
Similar Part No. - HI-8585PDIF |
|
Similar Description - HI-8585PDIF |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |