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HI-8383JT Datasheet(PDF) 8 Page - Holt Integrated Circuits |
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HI-8383JT Datasheet(HTML) 8 Page - Holt Integrated Circuits |
8 / 9 page HI-8382 PACKAGE DIMENSIONS inches (millimeters) Package Type: 16C 16-PIN CERAMIC SIDE-BRAZED DIP BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) BASE PLANE SEATING PLANE .050 ±.005 (1.270 ±.127) .295 ±.010 (7.493 ±.254) PIN 1 .018 ± .002 (.457 ±.051) .010 ±.002 (.254 ±.051) .035 ± .010 (.889 ±.254) .810 (20.574) .300 ± .010 (7.620 ±.254) .100 (2.54) BSC .200 (5.080) max .125 (3.175) min max 28-PIN PLASTIC PLCC inches (millimeters) Package Type: 28J .045 x 45° .453 ± .003 (11.506 ±.076) SQ. .490 ± .005 (12.446 ±.127) SQ. .045 x 45° .173 ±.008 (4.394 ±.203) PIN NO. 1 IDENT PIN NO. 1 .410 ±.020 (10.414 ±.508) .031 ±.005 (.787 ±.127) .017 ±.004 (.432 ±.102) .050 (1.27) BSC DETAIL A .035 .889 R .010 ± .001 (.254 ± .03) .020 (.508) min See Detail A BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 8 |
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