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SIP32453DB-T2-GE1 Datasheet(PDF) 8 Page - Vishay Siliconix |
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SIP32453DB-T2-GE1 Datasheet(HTML) 8 Page - Vishay Siliconix |
8 / 10 page www.vishay.com 8 Document Number: 63315 S11-1695-Rev. B, 22-Aug-11 Vishay Siliconix SiP32452, SiP32453 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DETAILED DESCRIPTION SiP32452 and SiP32453 are n-channel power MOSFET designed as high side load switch. Once enable the device charge pumps the gate of the power MOSFET to a constant gate to source voltage for fast turn on time. The mostly constant gate to source voltage keeps the on resistance low through out the input voltage range. When disable, the SiP32452 pulls the gate of the output n-channel low right away for a fast turn off delay while there is a build-in turn off delay for the SiP32453. The turn off delay for the SiP32453 is guaranteed to be at least 30 µs. Because the body of the output n-channel is always connected to GND, it prevents the current from going back to the input in case the output voltage is higher than the output. APPLICATION INFORMATION Input Capacitor While a bypass capacitor on the input is not required, a 4.7 µF or larger capacitor for CIN is recommended in almost all applications. The bypass capacitor should be placed as physically close as possible to the input pin to be effective in minimizing transients on the input. Ceramic capacitors are recommended over tantalum because of their ability to withstand input current surges from low impedance sources such as batteries in portable devices. Output Capacitor A 0.1 µF capacitor across VOUT and GND is recommended to insure proper slew operation. There is inrush current through the output MOSFET and the magnitude of the inrush current depends on the output capacitor, the bigger the COUT the higher the inrush current. There are no ESR or capacitor type requirement. Enable The EN pin is compatible with CMOS logic voltage levels. It requires at least 0.1 V or below to fully shut down the device and 1.5 V or above to fully turn on the device. Protection Against Reverse Voltage Condition Both the SiP32452 and SiP32453 can block the output current from going to the input in case where the output voltage is higher than the input voltage when the main switch is off. Thermal Considerations These devices are designed to maintain a constant output load current. Due to physical limitations of the layout and assembly of the device the maximum switch current is 1.2 A as stated in the Absolute Maximum Ratings table. However, another limiting characteristic for the safe operating load current is the thermal power dissipation of the package. To obtain the highest power dissipation (and a thermal resistance of 280 °C/W) the device should be connected to a heat sink on the printed circuit board. The maximum power dissipation in any application is dependant on the maximum junction temperature, TJ(max.) = 125 °C, the junction-to-ambient thermal resistance, J-A = 280 °C/W, and the ambient temperature, TA, which may be formulaically expressed as: It then follows that, assuming an ambient temperature of 70 °C, the maximum power dissipation will be limited to about 196 mW. So long as the load current is below the 1.2 A limit, the maximum continuous switch current becomes a function two things: the package power dissipation and the RDS(ON) at the ambient temperature. As an example let us calculate the worst case maximum load current at TA = 70 °C. The worst case RDS(ON) at 25 °C is 65 m . The R DS(ON) at 70 °C can be extrapolated from this data using the following formula: RDS(ON) (at 70 °C) = RDS(ON) (at 25 °C) x (1 + TC x T) Where TC is 3900 ppm/°C. Continuing with the calculation we have RDS(ON) (at 70 °C) = 65 m x (1 + 0.0039 x (70 °C - 25 °C)) = 76.4 m The maximum current limit is then determined by which in case is 1.6 A. Under the stated input voltage condition, if the 1.6 A current limit is exceeded the internal die temperature will rise and eventually, possibly damage the device. To avoid possible permanent damage to the device and keep a reasonable design margin, it is recommended to operate the device maximum up to 1.2 A only as listed in the Absolute Maximum Ratings table. 280 125 (max.) (max.) A A J A J T T T P - = - = - θ ) ( (max.) (max.) ON DS LOAD R P I < |
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