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ISL54233IRTZ-T Datasheet(PDF) 4 Page - Intersil Corporation |
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ISL54233IRTZ-T Datasheet(HTML) 4 Page - Intersil Corporation |
4 / 18 page ISL54233 4 FN7918.0 December 21, 2011 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V Input Voltages 1D+, 1D-, 2D+, 2D-, 3D+, 3D- . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to 5.5V C0, C1 (Note 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V Output Voltages COM-, COM+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to 5.5V Continuous Current (1D-, 1D+, 2D-, 2D+, 3D-, 3D+). . . . . . . . . . . . . . . . . ±40mA Peak Current (1D-, 1D+, 2D-, 2D+, 3D-, 3D+) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . . . . . ±100mA ESD Rating: Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . >5kV Machine Model (Tested per JESD22-A115B) . . . . . . . . . . . . . . . . . >400V Charged Device Model (Tested per JESD22-C110D) . . . . . . . . . . . . >2kV Latch-up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . . . .at +85°C Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 12 Ld UTQFN Package (Notes 7, 10) . . . . . 155 90 12 Ld TQFN Package (Notes 8, 9) . . . . . . . 58 1.0 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range. . . . . . . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 4.6V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. Signals on C1 and C0 exceeding GND by specified amount are clamped. Limit current to maximum current ratings. 7. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 9. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 10. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications - 2.7V to 3.6V Supply TestConditions: VDD=+3.0V,GND=0V,VC0H,VC1H=1.4V,VC0L,VC1L =0.5V, (Note 11), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER TEST CONDITIONS TEMP (°C) MIN (Notes 12, 13) TYP MAX (Notes 12, 13) UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG VDD = 2.7V to 4.6V Full -1 - VDD V ON-Resistance, rON VDD = 2.7V, ICOMx = 17mA, VD+ or VD- = 0V to 400mV (see Figure 5, Note 15) 25 - 6 8 Ω Full - - 10 Ω rON Matching Between Channels, ΔrON VDD = 2.7V, ICOMx = 17mA, VD+ or VD- =Voltage at max rON, (Notes 15, 16) 25 - 0.07 0.5 Ω Full - - 0.55 Ω rON Flatness, rFLAT(ON) VDD = 2.7V, ICOMx = 17mA, VD+ or VD- = 0V to 400mV, (Notes 14, 15) 25 - 0.32 0.8 Ω Full - - 1.2 Ω ON-Resistance, rON VDD = 3.3V, ICOMx = 17mA, VD+ or VD- = 3.3V (see Figure 5, Note 15) +25 - 9.5 15 Ω Full - - 20 Ω OFF Leakage Current, IXD+(OFF) or IXD-(OFF), ICOMX(OFF) VDD = 4.6V, All OFF Mode (C0 = 0.5V, C1 = 0.5V), VCOM- or VCOM+ = 0.3V, 3.3V, VXD+ or VXD- = 3.3V, 0.3V 25 -15 - 15 nA Full -20 - 20 nA ON Leakage Current, IXD+(ON) or IXD-(ON), ICOMX(ON) VDD = 4.6V, VXD+ or VXD- = 0.3V, 3.3V, VCOM- or VCOM+ = 0.3V, 3.3V 25 -20 - 20 nA Full -25 - 25 nA DPDT DYNAMIC CHARACTERISTICS All OFF to ON or ON to All OFF Address Transition Time, tTRANS VDD = 2.7V, RL = 50Ω, CL = 10pF, (see Figure 3) 25 - 125 - ns Data Channel to Data Channel Address Transition Time, tTRANS VDD = 2.7V, RL = 50Ω, CL = 10pF, (see Figure 3) 25 - 125 - ns Break-Before-Make Time Delay, tD VDD = 3.6V, RL = 50Ω, CL = 10pF, (see Figure 4) 25 - 30 - ns Skew, (tSKEWOUT - tSKEWIN) VDD = 3.0V, RL = 45Ω, CL = 10pF, tR = tF = 500ps at 480Mbps, (Duty Cycle = 50%) (see Figure 8) 25 - 75 - ps Total Jitter, tJ VDD = 3.0V, RL = 50Ω, CL = 10pF, tR = tF = 500ps at 480Mbps 25 - 210 - ps |
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