www.vishay.com

Document Number: 81120

4

Rev. 1.1, 14-Jul-10

VEMT4700F

Vishay Semiconductors

Silicon NPN Phototransistor

Fig. 8 - Relative Spectral Sensitivity vs. Wavelength

Fig. 9 - Relative Radiant Sensitivity vs. Angular Displacement

PACKAGE DIMENSIONS in millimeters

SOLDER PROFILE

Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 168 h

Moisture sensitivity level 3, acc. to J-STD-020.

DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

750

850

950

1050

0

0.2

0.4

0.6

0.8

1.2

λ - Wavelength (nm)

1150

94 8408

1.0

0.4

0.2

0

94 8318

0.6

0.9

0.8

0°

30°

10°

20°

40°

50°

60°

70°

80°

0.7

1.0

Mounting Pad Layout

1.2

1.6 (1.9)

area covered with

solder resist

Dimensions: IR and vaporphase

(wave soldering)

4

21439

0

50

100

150

200

250

300

0

50

100

150

200

250

300

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s max. ramp down 6 °C/s

255 °C