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MAX8939EWV+T Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX8939EWV+T
Description  System Power Management for Mobile Handset
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX8939EWV+T Datasheet(HTML) 2 Page - Maxim Integrated Products

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2 ______________________________________________________________________________________
System Power Management
for Mobile Handset
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
BATT, OUT1, SAFE_OUT, and INVIB to AGND ....-0.3V to +6.0V
CHG_IN, OUT2, LED1, and LED2 to AGND .........-0.3V to +30V
LED3 and CHG_MON to AGND.... -0.3V to (VSAFE_OUT + 0.3V)
COMP2, IRQ, RESET_IN, COMP1, SCL, SDA, CHG,
PWR_ON_CMP, REF, LDO1, LDO2, LDO3, LDO4,
and LDO1_EN to AGND.................... -0.3V to (VBATT + 0.3V)
OUTVIB to AGND..................................-0.3V to (VINVIB + 0.3V)
PGND1 and PGND2 to AGND .............................-0.3V to +0.3V
LX1, LX2 Current (Note 1).............................................1.7ARMS
Continuous Power Dissipation (TA = +70NC)
WLP (derate 24.4mW/NC above +70NC)..........................1.9W
Operating Temperature...................................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VBATT = 3.7V, VCHG_IN = 5.0V, circuit of Figure 1, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.)
ABSOLUTE MAXIMUM RATINGS
Note 1: LX1 has internal clamp diodes to PGND1 and OUT1. LX2 has internal clamp diodes to PGND2 and OUT2. Applications
that forward bias these diodes should take care not to exceed the IC package power dissipation limit.
WLP
Junction-to-Ambient Thermal Resistance (
qJA) ..........41°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
BATT
BATT Operating Voltage
2.9
5.5
V
BATT Shutdown Supply Current
All outputs off, I2C disabled,
VSCL = VSDA= VRESET_IN = 0V
TA = +25NC
0.4
1
F
A
TA = +85NC
0.4
1
BATT Standby Supply Current
All outputs off, VSCL = VSDA =
VRESET_IN = 1.8V, I2C ready
TA = +25NC
5
10
F
A
TA = +85NC
5
BATT Biasing Supply Current
I2C ready, one or more outputs on
60
F
A
Undervoltage Lockout (UVLO)
Threshold
BATT rising
2.6
2.75
2.9
V
Undervoltage Lockout Hysteresis
100
mV
THERMAL SHUTDOWN
Threshold
+160
N
C
Hysteresis
20
N
C
REFERENCE
Reference Output Voltage
1.200
V
Reference Supply Rejection
0.2
mV
LOGIC AND CONTROL INPUTS
Input Low Level
SDA, SCL, LDO1_EN, CHG, and RESET_IN
0.4
V
Input High Level
SDA, SCL, LDO1_EN, CHG, and RESET_IN
1.40
V
Logic-Input Current
SDA, SCL, LDO1_EN, CHG,
and RESET_IN, 0 < VIN < 5.5V
TA = +25NC
-1
+1
F
A
TA = +85NC
0.1


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